Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6791034 | Circuit board and production method therefor | Masaki Suzumura, Kazuo Okada, Takaaki Okawa, Shinya Tanaka | 2004-09-14 |
| 6787884 | Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production | Seiichi Nakatani, Hiroyuki Handa, Tsunenori Yoshida, Yoshihisa Yamashita, Hiroyuki Ishitomi | 2004-09-07 |
| 6707671 | Power module and method of manufacturing the same | Yoshihisa Yamashita, Seiichi Nakatani | 2004-03-16 |
| 6700182 | Thermally conductive substrate, thermally conductive substrate manufacturing method and power module | Yoshihisa Yamashita, Seiichi Nakatani, Mitsuhiro Matsuo | 2004-03-02 |
| 6692818 | Method for manufacturing circuit board and circuit board and power conversion module using the same | Yoshihisa Yamashita, Seiichi Nakatani | 2004-02-17 |