Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825062 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku +2 more | 2004-11-30 |
| 6759737 | Semiconductor package including stacked chips with aligned input/output pads | Seong Min Seo, Young Suk Chung, Jong Sik Paek, Jae Hun Ku | 2004-07-06 |
| 6686258 | Method of trimming and singulating leaded semiconductor packages | — | 2004-02-03 |
| 6677663 | End grid array semiconductor package | Jae Hun Ku | 2004-01-13 |