Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825062 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Jae Hak Yee, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku +2 more | 2004-11-30 |
| 6759737 | Semiconductor package including stacked chips with aligned input/output pads | Seong Min Seo, Jong Sik Paek, Jae Hun Ku, Jae Hak Yee | 2004-07-06 |
| 6677662 | Clamp and heat block assembly for wire bonding a semiconductor package assembly | Soo Jung Park | 2004-01-13 |