Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825062 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Chung Suk Han, Jae Hun Ku +2 more | 2004-11-30 |