Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828671 | Enhanced BGA grounded heatsink | Weddie Aquien, Setho Sing Fee | 2004-12-07 |
| 6770962 | Disposable mold runner gate for substrate based electronic packages | — | 2004-08-03 |
| 6759752 | Single unit automated assembly of flex enhanced ball grid array packages | Raymundo M. Camenforte | 2004-07-06 |
| 6750082 | Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip | Roman Perez, Tan Kim Hwee | 2004-06-15 |