Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6750082 | Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip | John Briar, Roman Perez | 2004-06-15 |
| 6734039 | Semiconductor chip grid array package design and method of manufacture | Roman Perez, Kee Kwang Lau, Alex Chew, Antonio B. Dimaano, Jr. | 2004-05-11 |