Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6791346 | Testing of BGA and other CSP packages using probing techniques | Rajiv Mehta, Liop-Jin Yap, Chee Keong Tan | 2004-09-14 |
| 6759752 | Single unit automated assembly of flex enhanced ball grid array packages | John Briar | 2004-07-06 |
| 6744125 | Super thin/super thermal ball grid array package | Dioscoro A. Merilo, Seng Guan Chow | 2004-06-01 |