Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828224 | Method of fabricating substrate utilizing an electrophoretic deposition process | Takahiro Iijima, Akio Rokugawa | 2004-12-07 |
| 6764931 | Semiconductor package, method of manufacturing the same, and semiconductor device | Takahiro Iijima, Akio Rokugawa | 2004-07-20 |
| 6750541 | Semiconductor device | Nobuyuki Ohtsuka, Hisaya Sakai, Yoshiyuki Nakao, Hiroki Kondo, Takashi Suzuki | 2004-06-15 |
| 6746957 | Manufacture of semiconductor device with copper wiring | Nobuyuki Ohtsuka | 2004-06-08 |