Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828669 | Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof | Shinichi Wakabayashi, Yuichi Matsuda | 2004-12-07 |
| 6828224 | Method of fabricating substrate utilizing an electrophoretic deposition process | Akio Rokugawa, Noriyoshi Shimizu | 2004-12-07 |
| D496019 | Mobile phone | Norio Okada, Sugiko Honda | 2004-09-14 |
| 6783652 | Process for manufacturing a wiring board | Akio Rokugawa, Yasuyoshi Horikawa | 2004-08-31 |
| 6764931 | Semiconductor package, method of manufacturing the same, and semiconductor device | Akio Rokugawa, Noriyoshi Shimizu | 2004-07-20 |
| D488791 | Mobile phone | Sugiko Honda, Norio Okada | 2004-04-20 |
| D487736 | Mobile phone | Norio Okada | 2004-03-23 |
| D487071 | Mobile phone | Mihoko Hotta, Takayuki Miyazawa | 2004-02-24 |