Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828224 | Method of fabricating substrate utilizing an electrophoretic deposition process | Takahiro Iijima, Noriyoshi Shimizu | 2004-12-07 |
| 6783652 | Process for manufacturing a wiring board | Takahiro Iijima, Yasuyoshi Horikawa | 2004-08-31 |
| 6764931 | Semiconductor package, method of manufacturing the same, and semiconductor device | Takahiro Iijima, Noriyoshi Shimizu | 2004-07-20 |
| 6754952 | Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated | Akihito Takano, Akira Fujisawa | 2004-06-29 |