RK

Ryuichi Kyomasu

SH Shinkawa: 5 patents #1 of 24Top 5%
📍 Kodaira, JP: #2 of 129 inventorsTop 2%
Overall (2004): #7,479 of 270,089Top 3%
5
Patents 2004

Issued Patents 2004

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
6814121 Bonding apparatus Shigeru Hayata, Satoshi Enokido, Toshiaki Sasano 2004-11-09
6766936 Transducer and a bonding apparatus using the same Osamu Kakutani, Yoshihiko Seino 2004-07-27
6762848 Offset measurement method, tool position detection method and bonding apparatus Shigeru Hayata, Satoshi Enokido, Toshiaki Sasano 2004-07-13
6727666 XY table for a semiconductor manufacturing apparatus Hiroto Urabayashi, Minoru Torihata, Kuniyuki Takahashi, Toshimichi Miyahara 2004-04-27
6719183 Transducer and a bonding apparatus using the same Yoshihiko Seino 2004-04-13