Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6766936 | Transducer and a bonding apparatus using the same | Ryuichi Kyomasu, Yoshihiko Seino | 2004-07-27 |
| 6760968 | Die packing device | Tsutomu Mimata | 2004-07-13 |
| 6685984 | Method for the production of multilayers | Makoto Higami, Kohei Goto, Yoichi Asano, Ryoichiro Takahashi, Gen Okiyama | 2004-02-03 |