Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787897 | Wafer-level package with silicon gasket | Frank S. Geefay, Ann Mattos, Domingo Figueredo | 2004-09-07 |
| 6777263 | Film deposition to enhance sealing yield of microcap wafer-level package with vias | Richard C. Ruby, Frank S. Geefay, Andrew Thomas Barfknecht | 2004-08-17 |
| 6777267 | Die singulation using deep silicon etching | Richard C. Ruby, Frank S. Geefay, Cheol Han, Andrew Thomas Barfknecht | 2004-08-17 |
| 6763702 | Method and apparatus for hermeticity determination and leak detection in semiconductor packaging | Allen Chien, Frank S. Geefay, Cheol Han | 2004-07-20 |