Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836013 | Method for sealing a semiconductor device and apparatus embodying the method | — | 2004-12-28 |
| 6787897 | Wafer-level package with silicon gasket | Qing-Cao Gan, Ann Mattos, Domingo Figueredo | 2004-09-07 |
| 6777263 | Film deposition to enhance sealing yield of microcap wafer-level package with vias | Qing-Cao Gan, Richard C. Ruby, Andrew Thomas Barfknecht | 2004-08-17 |
| 6777267 | Die singulation using deep silicon etching | Richard C. Ruby, Cheol Han, Qing-Cao Gan, Andrew Thomas Barfknecht | 2004-08-17 |
| 6763702 | Method and apparatus for hermeticity determination and leak detection in semiconductor packaging | Allen Chien, Cheol Han, Qing-Cao Gan | 2004-07-20 |