Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777263 | Film deposition to enhance sealing yield of microcap wafer-level package with vias | Qing-Cao Gan, Richard C. Ruby, Frank S. Geefay | 2004-08-17 |
| 6777267 | Die singulation using deep silicon etching | Richard C. Ruby, Frank S. Geefay, Cheol Han, Qing-Cao Gan | 2004-08-17 |