Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828229 | Method of manufacturing interconnection line in semiconductor device | Soo-geun Lee, Kyoung-Woo Lee, Jae Hak Kim | 2004-12-07 |
| 6815331 | Method for forming metal wiring layer of semiconductor device | Kyoung-Woo Lee, Jae Hak Kim, Soo-geun Lee | 2004-11-09 |
| 6777322 | Method for fabricating a multi-layered dielectric layer including insulating layer having Si-CH3 bond therein | Hyun Dam Jeong, Hee-Sook Park, Byeong-Jun Kim | 2004-08-17 |