Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777322 | Method for fabricating a multi-layered dielectric layer including insulating layer having Si-CH3 bond therein | Hyun Dam Jeong, Hee-Sook Park, Hong-Jae Shin | 2004-08-17 |