Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790758 | Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging | Han-Kun Hsieh | 2004-09-14 |
| 6765301 | Integrated circuit bonding device and manufacturing method thereof | Chung-Ju Wu, Kuei-Chen Liang | 2004-07-20 |
| 6753595 | Substrates for semiconductor devices with shielding for NC contacts | Chung-Ju Wu, Wen-Yu Lo, Wen-Dong Yen | 2004-06-22 |
| 6747350 | Flip chip package structure | Yin-Chieh Hsueh, Chung-Ju Wu | 2004-06-08 |
| 6744128 | Integrated circuit package capable of improving signal quality | Chung-Ju Wu, Kuei-Chen Liang | 2004-06-01 |
| 6720246 | Flip chip assembly process for forming an underfill encapsulant | Han-Kun Hsieh | 2004-04-13 |
| 6707677 | Chip-packaging substrate and test method therefor | Han-Kun Hsieh, Yi-Chang Hsieh | 2004-03-16 |