Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790758 | Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging | Wei-Feng Lin | 2004-09-14 |
| 6720246 | Flip chip assembly process for forming an underfill encapsulant | Wei-Feng Lin | 2004-04-13 |
| 6707677 | Chip-packaging substrate and test method therefor | Wei-Feng Lin, Yi-Chang Hsieh | 2004-03-16 |