Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6765301 | Integrated circuit bonding device and manufacturing method thereof | Kuei-Chen Liang, Wei-Feng Lin | 2004-07-20 |
| 6753595 | Substrates for semiconductor devices with shielding for NC contacts | Wei-Feng Lin, Wen-Yu Lo, Wen-Dong Yen | 2004-06-22 |
| 6747350 | Flip chip package structure | Wei-Feng Lin, Yin-Chieh Hsueh | 2004-06-08 |
| 6744128 | Integrated circuit package capable of improving signal quality | Kuei-Chen Liang, Wei-Feng Lin | 2004-06-01 |