Issued Patents 2004
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835653 | Method of forming adjacent holes on a semiconductor substrate | Tse-Yao Huang | 2004-12-28 |
| 6833081 | Method of metal etching post cleaning | Hui-Min Mao, Shih-Chieh Kao, Tien-Sung Chen | 2004-12-21 |
| 6825094 | Method for increasing capacitance of deep trench capacitors | Chang-Rong Wu | 2004-11-30 |
| 6818524 | Method of improving alignment for semiconductor fabrication | Tung-Liang Yang | 2004-11-16 |
| 6815356 | Method for forming bottle trench | Tzu-Ching Tsai, Hsin-Jung Ho | 2004-11-09 |
| 6808979 | Method for forming vertical transistor and trench capacitor | Shian-Jyh Lin | 2004-10-26 |
| 6800535 | Method for forming bottle-shaped trenches | Tzu-Ching Tsai, Hsin-Jung Ho | 2004-10-05 |
| 6797564 | Method of forming bit lines and bit line contacts in a memory device | Kuo-Chien Wu | 2004-09-28 |
| 6794270 | Method for shallow trench isolation fabrication and partial oxide layer removal | Pei-Ing Lee, Chang-Rong Wu, Tzu-En Ho, Hsien Wen Su | 2004-09-21 |
| 6790765 | Method for forming contact | Tse-Yao Huang, Hui-Min Mao | 2004-09-14 |
| 6790735 | Method of forming source/drain regions in semiconductor devices | Hui-Min Mao, Sheng-Tsung Chen, Bo Ching Jiang, Chih-Yuan Hsiao | 2004-09-14 |
| 6790740 | Process for filling polysilicon seam | Tse-Yao Huang, Tzu-Ching Tsai | 2004-09-14 |
| 6780739 | Bit line contact structure and method for forming the same | Hui-Min Mao | 2004-08-24 |
| 6774007 | Method of fabricating shallow trench isolation | Hsien-Wen Liu, Hui-Min Mao, Yi-Chen Chen | 2004-08-10 |
| 6737334 | Method of fabricating a shallow trench isolation structure | Tzu-En Ho, Chang-Rong Wu | 2004-05-18 |
| 6727159 | Method of forming a shallow trench isolation in a semiconductor substrate | Hsien-Wen Liu, Kaan-Lu Tzou | 2004-04-27 |
| 6716696 | Method of forming a bottle-shaped trench in a semiconductor substrate | Hsien-Wen Liu | 2004-04-06 |
| 6713341 | Method of forming a bottle-shaped trench in a semiconductor substrate | Hsien-Wen Liu, Hsin-Chuan Tsai | 2004-03-30 |
| 6709975 | Method of forming inter-metal dielectric | Hui-Min Mao, Tzu-Ching Tsai | 2004-03-23 |
| 6693006 | Method for increasing area of a trench capacitor | Hsin-Jung Ho, Chang-Rong Wu, Tung-Wang Huang | 2004-02-17 |