Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6791177 | Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate | Aritharan Thurairajaratnam, Edwin M. Fulcher | 2004-09-14 |
| 6768386 | Dual clock package option | — | 2004-07-27 |
| 6762366 | Ball assignment for ball grid array package | Farshad Ghahghahi, Edwin M. Fulcher | 2004-07-13 |
| 6744130 | Isolated stripline structure | Aritharan Thurairajaratnam, Edwin M. Fulcher | 2004-06-01 |
| 6701270 | Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the source | Anand Govind | 2004-03-02 |
| 6680532 | Multi chip module | Kishor Desai | 2004-01-20 |