Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777314 | Method of forming electrolytic contact pads including layers of copper, nickel, and gold | John McCormick, Maniam Alagaratnam | 2004-08-17 |
| 6680532 | Multi chip module | Leah M. Miller | 2004-01-20 |