Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828643 | Bonding pads over input circuits | — | 2004-12-07 |
| 6798035 | Bonding pad for low k dielectric | Qwai H. Low, Ramaswamy Ranganathan | 2004-09-28 |
| 6791177 | Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate | Leah M. Miller, Aritharan Thurairajaratnam | 2004-09-14 |
| 6762366 | Ball assignment for ball grid array package | Leah M. Miller, Farshad Ghahghahi | 2004-07-13 |
| 6744130 | Isolated stripline structure | Leah M. Miller, Aritharan Thurairajaratnam | 2004-06-01 |