Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825563 | Slotted bonding pad | Maurice Othieno, Qwai H. Low | 2004-11-30 |
| 6798035 | Bonding pad for low k dielectric | Qwai H. Low, Edwin M. Fulcher | 2004-09-28 |
| 6781150 | Test structure for detecting bonding-induced cracks | Qwai H. Low, Anwar Ali, Tauman T. Lau | 2004-08-24 |
| 6743979 | Bonding pad isolation | Michael Berman, Aftab Ahmad, Qwai H. Low, Chok J. Chia | 2004-06-01 |