Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6765289 | Reinforcement material for silicon wafer and process for producing IC chip using said material | Yasukazu Nakata, Takeshi Kondo, Hideo Senoo | 2004-07-20 |
| 6718223 | Method of processing semiconductor wafer and semiconductor wafer supporting member | Hayato Noguchi, Katsuhisa Taguchi, Kazuyoshi Ebe | 2004-04-06 |