TK

Takeshi Kondo

LI Lintec: 2 patents #6 of 53Top 15%
Overall (2004): #39,261 of 270,089Top 15%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6793762 Method of using a pressure sensitive adhesive sheet Kazuhiro Takahashi, Yoshihisa Mineura 2004-09-21
6765289 Reinforcement material for silicon wafer and process for producing IC chip using said material Yasukazu Nakata, Yuichi Iwakata, Hideo Senoo 2004-07-20