Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6765289 | Reinforcement material for silicon wafer and process for producing IC chip using said material | Yasukazu Nakata, Yuichi Iwakata, Takeshi Kondo | 2004-07-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6765289 | Reinforcement material for silicon wafer and process for producing IC chip using said material | Yasukazu Nakata, Yuichi Iwakata, Takeshi Kondo | 2004-07-20 |