Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800554 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Paul McGregor, Carolyn Block, Shu Jin | 2004-10-05 |
| 6794755 | Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement | Jose Maiz, Xiaorong Morrow, Carolyn Block, Jihperng Leu, Paul McGregor +2 more | 2004-09-21 |
| 6777810 | Interconnection alloy for integrated circuits | Donald S. Gardner | 2004-08-17 |
| 6740427 | Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same | Madhav Datta, Dave Emory, Tzeun-luh Huang, Subhash M. Joshi, Christine A. King +4 more | 2004-05-25 |