Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800554 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Thomas Marieb, Carolyn Block, Shu Jin | 2004-10-05 |
| 6794755 | Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement | Jose Maiz, Xiaorong Morrow, Thomas Marieb, Carolyn Block, Jihperng Leu +2 more | 2004-09-21 |
| 6696758 | Interconnect structures and a method of electroless introduction of interconnect structures | Valery M. Dubin, Christopher D. Thomas, Madhav Datta | 2004-02-24 |