Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6750133 | Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps | — | 2004-06-15 |
| 6740427 | Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same | Dave Emory, Tzeun-luh Huang, Subhash M. Joshi, Christine A. King, Zhiyong Ma +4 more | 2004-05-25 |
| 6703069 | Under bump metallurgy for lead-tin bump over copper pad | Peter K. Moon, Zhiyong Ma | 2004-03-09 |
| 6696758 | Interconnect structures and a method of electroless introduction of interconnect structures | Valery M. Dubin, Christopher D. Thomas, Paul McGregor | 2004-02-24 |