Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6817091 | Electronic assembly having solder thermal interface between a die substrate and a heat spreader | Thomas J. Fitzgerald, Carl Deppisch | 2004-11-16 |
| 6813153 | Polymer solder hybrid | Paul A. Koning | 2004-11-02 |