Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6813153 | Polymer solder hybrid | Fay Hua | 2004-11-02 |
| 6787899 | Electronic assemblies with solidified thixotropic thermal interface material | Agostino C. Rinella | 2004-09-07 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6813153 | Polymer solder hybrid | Fay Hua | 2004-11-02 |
| 6787899 | Electronic assemblies with solidified thixotropic thermal interface material | Agostino C. Rinella | 2004-09-07 |