Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6817091 | Electronic assembly having solder thermal interface between a die substrate and a heat spreader | Carl Deppisch, Fay Hua | 2004-11-16 |
| 6751099 | Coated heat spreaders | Joan K. Vrtis, Joni G. Hansen, Carl Deppisch | 2004-06-15 |