Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812548 | Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices | Rajen Dias | 2004-11-02 |
| 6790709 | Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices | Rajen Dias | 2004-09-14 |
| 6752634 | Contact array for semiconductor package | Carlos Gonzalez | 2004-06-22 |
| 6750549 | Variable pad diameter on the land side for improving the co-planarity of ball grid array packages | Carlos Gonzalez | 2004-06-15 |
| 6672892 | Package retention module coupled directly to a socket | Carlos Gonzalez | 2004-01-06 |