Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6752634 | Contact array for semiconductor package | Biju Chandran | 2004-06-22 |
| 6750549 | Variable pad diameter on the land side for improving the co-planarity of ball grid array packages | Biju Chandran | 2004-06-15 |
| 6750551 | Direct BGA attachment without solder reflow | Kristopher Frutschy, Charles A. Gealer | 2004-06-15 |
| 6672892 | Package retention module coupled directly to a socket | Biju Chandran | 2004-01-06 |