Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815831 | Flip-chip device with multi-layered underfill having graded coefficient of thermal expansion | — | 2004-11-09 |
| 6812548 | Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices | Biju Chandran | 2004-11-02 |
| 6790709 | Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices | Biju Chandran | 2004-09-14 |