Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6826037 | Electronic structure | Harry Hedler, Thorsten Meyer | 2004-11-30 |
| 6756540 | Self-adhering chip | Harry Hedler | 2004-06-29 |
| 6744127 | Semiconductor chip, memory module and method for testing the semiconductor chip | Harry Hedler, Jochen Müller | 2004-06-01 |
| 6727576 | Transfer wafer level packaging | Harry Hedler, Thorsten Meyer | 2004-04-27 |
| 6714418 | Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another | Gerd Frankowsky, Harry Hedler, Roland Irsigler, Thorsten Meyer | 2004-03-30 |
| 6709953 | Method of applying a bottom surface protective coating to a wafer, and wafer dicing method | David Wallis, Sylvia Baumann Winter | 2004-03-23 |
| 6707746 | Fuse programmable I/O organization | Gerd Frankowsky | 2004-03-16 |