DW

David Wallis

Infineon Technologies Ag: 2 patents #200 of 1,096Top 20%
Motorola: 1 patents #299 of 1,275Top 25%
SK Semiconductor 300 Gmbh & Co. Kg: 1 patents #1 of 7Top 15%
Overall (2004): #67,730 of 270,089Top 30%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6752694 Apparatus for and method of wafer grinding Manfred Schneegans, Michael Roesner 2004-06-22
6709953 Method of applying a bottom surface protective coating to a wafer, and wafer dicing method Barbara Vasquez, Sylvia Baumann Winter 2004-03-23