Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6826037 | Electronic structure | Thorsten Meyer, Barbara Vasquez | 2004-11-30 |
| 6807064 | Electronic component with at least one semiconductor chip and method for producing the electronic component | Thorsten Meyer | 2004-10-19 |
| 6756540 | Self-adhering chip | Barbara Vasquez | 2004-06-29 |
| 6744127 | Semiconductor chip, memory module and method for testing the semiconductor chip | Jochen Müller, Barbara Vasquez | 2004-06-01 |
| 6727576 | Transfer wafer level packaging | Thorsten Meyer, Barbara Vasquez | 2004-04-27 |
| 6714418 | Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another | Gerd Frankowsky, Roland Irsigler, Thorsten Meyer, Barbara Vasquez | 2004-03-30 |