Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6823581 | Apparatus for assembling a head gimbal assembly | Takao Kidachi, Tadaaki Tomiyama, Yoshio Uematsu, Hiromi Ishikawa, Hiroyoshi Yokome +3 more | 2004-11-30 |
| 6742694 | Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus | Takuya Satoh, Tatsumi Tsuchiya, Yasuhiro Mita, Lan Shi, Hiroyoshi Yokome +1 more | 2004-06-01 |
| 6676005 | Wire bonding method and apparatus | Kenji Itoh, Naoki Kurosu, Yohtaroh Ichimura | 2004-01-13 |
| 6676778 | Method for bonding slider and suspension together and deciding conditions of laser beam irradiation | Tatsumi Tuchiya, Naoki Fujii, Surya Pattanaik, William A. Childers, Diane Sprandel O'Regan +2 more | 2004-01-13 |