Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833978 | Micro-actuator integrated lead suspension head terminations | Victor Wing Chun Shum | 2004-12-21 |
| 6785094 | Weld free high performance laminate suspension | Satya Prakash Arya, Tzong-Shii Pan, Victor Wing Chun Shum | 2004-08-31 |
| 6742694 | Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus | Takuya Satoh, Tatsumi Tsuchiya, Yasuhiro Mita, Lan Shi, Hiroyoshi Yokome +1 more | 2004-06-01 |
| 6676778 | Method for bonding slider and suspension together and deciding conditions of laser beam irradiation | Tatsumi Tuchiya, Tatsushi Yoshida, Naoki Fujii, William A. Childers, Diane Sprandel O'Regan +2 more | 2004-01-13 |