Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6823581 | Apparatus for assembling a head gimbal assembly | Takao Kidachi, Tadaaki Tomiyama, Yoshio Uematsu, Hiromi Ishikawa, Tatsushi Yoshida +3 more | 2004-11-30 |
| 6742694 | Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus | Takuya Satoh, Yasuhiro Mita, Lan Shi, Hiroyoshi Yokome, Tatsushi Yoshida +1 more | 2004-06-01 |