Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835292 | Electrochemical thin film polishing method and polishing apparatus | Shuzo Sato, Yuji Segawa, Akira Yoshiq | 2004-12-28 |
| 6809029 | Semiconductor production device and production method for semiconductor device | Naoki Komai | 2004-10-26 |
| 6808617 | Electrolytic polishing method | Shuzo Sato, Yuji Segawa, Akira Yoshio | 2004-10-26 |
| 6797623 | Methods of producing and polishing semiconductor device and polishing apparatus | Shuzo Sato, Yuji Segawa, Akira Yoshio, Hiizu Ootorii, Zenya Yasuda +2 more | 2004-09-28 |
| 6777321 | Method of forming buried wiring | Naoki Komai, Koichi Ikeda, Takashi Kinoshita, Kohei Suzuki, Nobuyuki Kawakami +1 more | 2004-08-17 |
| 6736699 | Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing | Naoki Komai, Hideyuki Kito, Mitsuru Taguchi | 2004-05-18 |
| 6734559 | Self-aligned semiconductor interconnect barrier and manufacturing method therefor | Kai Yang, Dirk Brown, Shekhar Pramanick | 2004-05-11 |
| 6710447 | Integrated circuit chip with high-aspect ratio vias | — | 2004-03-23 |
| 6709979 | Method of manufacturing a semiconductor device | Naoki Komai, Hideyuki Kito, Mitsuru Taguchi, Katsumi Ando | 2004-03-23 |
| 6693036 | Method for producing semiconductor device polishing apparatus, and polishing method | Akira Yoshio, Shuzo Sato | 2004-02-17 |