Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6762367 | Electronic package having high density signal wires with low resistance | Jean Audet, Timothy W. Budell | 2004-07-13 |
| 6703706 | Concurrent electrical signal wiring optimization for an electronic package | Jean Audet, Timothy W. Budell, Alain Caron | 2004-03-09 |
| 6677774 | Method for locating IDDQ defects using multiple controlled collapse chip connections current measurement on an automatic tester | Douglas C. Heaberlin, Leah Pastel, Yu Sun | 2004-01-13 |