TB

Timothy W. Budell

IBM: 3 patents #575 of 5,464Top 15%
📍 Colchester, VT: #8 of 60 inventorsTop 15%
🗺 Vermont: #50 of 538 inventorsTop 10%
Overall (2004): #19,142 of 270,089Top 8%
3
Patents 2004

Issued Patents 2004

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6793500 Radial contact pad footprint and wiring for electrical components Esmaeil Rahmati, David B. Stone, Jerzy M. Zalesinski 2004-09-21
6762367 Electronic package having high density signal wires with low resistance Jean Audet, Patrick H. Buffet 2004-07-13
6703706 Concurrent electrical signal wiring optimization for an electronic package Jean Audet, Patrick H. Buffet, Alain Caron 2004-03-09