Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835633 | SOI wafers with 30-100 å buried oxide (BOX) created by wafer bonding using 30-100 å thin oxide as bonding layer | Hussein I. Hanafi, Erin C. Jones, Dominic J. Schepis, Leathen Shi | 2004-12-28 |
| 6762469 | High performance CMOS device structure with mid-gap metal gate | Anda C. Mocuta, Meikei Ieong, Ricky S. Amos, Dan M. Mocuta, Huajie Chen | 2004-07-13 |