Issued Patents 2004
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835898 | ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2004-12-28 |
| 6827584 | Interconnect for microelectronic structures with enhanced spring characteristics | Gaetan L. Mathieu | 2004-12-07 |
| 6825422 | Interconnection element with contact blade | Gary W. Grube, Igor Y. Khandros, Alec Madsen, Gaetan L. Mathieu | 2004-11-30 |
| 6825052 | Test assembly including a test die for testing a semiconductor product die | Igor Y. Khandros, David V. Pedersen, Ralph G. Whitten | 2004-11-30 |
| 6807734 | Microelectronic contact structures, and methods of making same | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2004-10-26 |
| 6791176 | Lithographic contact elements | Gaetan L. Mathieu, Gary W. Grube | 2004-09-14 |
| 6780001 | Forming tool for forming a contoured microelectronic spring mold | Stuart Wenzel | 2004-08-24 |
| 6778406 | Resilient contact structures for interconnecting electronic devices | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2004-08-17 |
| 6764869 | Method of assembling and testing an electronics module | — | 2004-07-20 |
| 6759311 | Fan out of interconnect elements attached to semiconductor wafer | Igor Y. Khandros | 2004-07-06 |
| 6741092 | Method and system for detecting an arc condition | Stefan Jan Juergen Zschiegner | 2004-05-25 |
| 6741085 | Contact carriers (tiles) for populating larger substrates with spring contacts | Igor Y. Khandros, Gaetan L. Mathieu, Thomas H. Dozier, II, William D. Smith | 2004-05-25 |
| 6729019 | Method of manufacturing a probe card | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2004-05-04 |
| 6727580 | Microelectronic spring contact elements | Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen | 2004-04-27 |
| 6727579 | ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2004-04-27 |
| 6724209 | Method for testing signal paths between an integrated circuit wafer and a wafer tester | Ralph G. Whitten | 2004-04-20 |
| 6714828 | Method and system for designing a probe card | Mark W. Brandemuehl, Stefan Graef, Yves Parent | 2004-03-30 |
| 6713374 | Interconnect assemblies and methods | Gaetan L. Mathieu | 2004-03-30 |
| 6705876 | Electrical interconnect assemblies and methods | — | 2004-03-16 |
| 6672875 | Spring interconnect structures | Gaetan L. Mathieu, Gary W. Grube, Richard A. Larder | 2004-01-06 |