Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836023 | Structure of integrated trace of chip package | Chung-Lin Wu | 2004-12-28 |
| 6806580 | Multichip module including substrate with an array of interconnect structures | Maria Cristina Estacio | 2004-10-19 |
| 6798044 | Flip chip in leaded molded package with two dies | — | 2004-09-28 |
| 6753605 | Passivation scheme for bumped wafers | — | 2004-06-22 |
| 6731003 | Wafer-level coated copper stud bumps | Consuelo Tangpuz, Erwin Victor Cruz | 2004-05-04 |
| 6720642 | Flip chip in leaded molded package and method of manufacture thereof | Consuelo Tangpuz, Romel N. Manatad | 2004-04-13 |
| 6696321 | High performance multi-chip flip chip package | — | 2004-02-24 |
| 6683375 | Semiconductor die including conductive columns | Chung-Lin Wu | 2004-01-27 |