Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6731003 | Wafer-level coated copper stud bumps | Rajeev Joshi, Erwin Victor Cruz | 2004-05-04 |
| 6720642 | Flip chip in leaded molded package and method of manufacture thereof | Rajeev Joshi, Romel N. Manatad | 2004-04-13 |